Ultrasonic FAQs

How do I know if ultrasonic soldering is right for my application?

The ultrasonic soldering iron, without exception, can be used for all applications currently carried out by conventional soldering irons.

By comparison with the normal soldering iron and its range of wattages as used in the mechanical, electrical and electronics industry, the ultrasonic iron has a digitally controlled 80 watt rating heating element which covers these ranges. It incorporates the conventional range of tip sizes, for all comparable applications.

What are Ultrasonic Soldering?

Ultrasonic soldering

The Ultrasonic soldering process can be applied to soft soldering and other manufacturing techniques in a wide variety of mechanical, electrical, electronics and related industries. Ultrasonic soldering can be used for the soldering and tinning of conventional solder joints and a wide range of solder tinning with any form or type of ceramic materials, glass and ferrous or non-ferrous metals including copper and aluminum.

How Does It Work?

The Ultrasonic Soldering Iron is similar to a conventional soldering iron containing a normal heating element and soldering iron tip but also includes an Ultrasonic Generator and Transducer. The ‘ultrasonic amplitude’, or operating frequency, (high velocity oscillation) of the soldering iron tip enables solder joints to be made without the use of a flux (the flux being the conventional means of removing oxides from surfaces to be soldered). This enables inter-metallic wetting or bonding of soldered joints. The standard operating frequency of the Ultrasonic Iron is nominally 40 KHz. The removal of flux from a printed circuit board or a solder joint means board cleaning no longer needs to be carried out, greatly reducing cost and improving quality. The solder joint quality is dramatically improved as perfect intermetallic bonds are made using the iron.

What Types Of Solder Alloy Can I Use For My Applications?

Any manufacturer’s specification of leaded or unleaded alloy, including the complete range of Indium based alloys.

What are the advantages of not using flux with Ultrasonic soldering?

Whether you use a liquid, or a solder paste, flux will be used in conventional soldering. The composition of the flux contains an aggressive, generally acid based liquid solution, which when subjected to heat from a soldering iron tip boils as the tip temperature is in excess of 100 degrees C in order to melt the alloy. This then creates voids or microscopic bubbles in the solder of the joint/s being made. Microscopic sectioning of a typical solder joint made with a liquid flux will show these faults. This condition can result in dry joints and poor joint continuity, particularly in ultra-low current circuits, where conventional low residue non active fluxes (non-conductive types) are used. Leakage currents can still be detected after conventional soldering leading to failure of the circuit/s. With the increasing use of high density “micro” surface mount printed circuit boards, and other electrically sensitive designs the elimination of flux ensures clinically clean surfaces and avoids this possibility.

Technical Information download (pdf)